CHO-BOND 1029 3oz Kit


SKU: CX50001029 0000 Categories: ,


CHO-BOND 1029 is a two component, silver plated, copper filled, flexible, electrically conductive silicone adhesive

CHO-BOND 1029 Technical Data Sheet

Value Proposition

CHO-BOND 1029 is a silver plated copper filled, two-component conductive silicone designed for applications where a flexible, strong, conductive electrical bond must be achieved. CHO-BOND 1029 greatly simplifies the problem of bonding conductive silicone EMI gaskets to metal substrates. It is formulated for relatively small bond lines (less than 0.010 inches (0.25mm)), and should not be used as an EMI caulk where bond lines are greater than 0.10 inches (0.25 mm). Low volatile organic compounds (VOCs) and minimal shrinkage upon curing make CHO-BOND 1029 a good choice for a variety of commercial and military applications. Curing of CHO-BOND 1029 can be achieved in as little as 30 minutes with heat to minimize equipment downtime and increase manufacturing throughput. CHO-BOND 1029 is supplied as a two component system, one part liquid and one part wet powder solid. For optimum mixing and material performance, the sand-like solid part should be added incrementally to the liquid part and mixed slowly over a 10 minute time period. For best adhesion results, CHO-BOND 1029 should be used in conjunction with CHO-SHIELD 1085 primer. Typical applications include bonding, repair, and attachment of EMI gaskets, and sealing around EMI vents and windows.


Typical Properties Typical Values Test Method
Polymer Silicone N/A
Filler Silver-Plated Copper N/A
Mix Ratio, A : B (by weight) 1.0 : 2.5 N/A
Color Brownish Red N/A (Q)
Consistency Thick Paste N/A (Q)
Maximum DC Volume Resistivity 0.060 ohm-cm CHO-95-40-5101* (Q/C)
Minimum Lap Shear Strength** 450 psi (3103 kPa) CHO-95-40-5300* (Q/C)
Minimum Peel Strength** 6.0 lb./inch (700 N/m) CHO-95-40-5302*(Q/C)
Specific Gravity 3.1 ASTM D792 (Q/C)
Hardness (Cure Cycle 1) 80 Shore A ASTM-D2240 (Q)
Continuous Use Temperature - 55°C to 125°C (-67 °F to 257 °F) N/A (Q)
Elevated Temperature Cure Cycle 0.5 hour @ 121 oC (250 oF) N/A
Room Temperature Cure 1 week*** N/A (Q)
Working Life 2.0 hours N/A (Q)
Shelf Life, unopened 6 months @ 25°C (77°F) N/A (Q)
Minimum thickness recommended N/A N/A
Maximum thickness recommended 0.008 in (0.20 mm) N/A
Volatile Organic Content (VOC) 14 g/l Calculated
Typical Coverage Area at 0.010” Thick per Pound (454 grams) 900 in2 (5806 cm2) N/A
Theoretical Coverage - Length of an 1/8” Diameter Bead per Pound (454 grams) 60 feet (18.3 m) N/A

Features and Benefits

  • Two component.
  • Fast heat cure, increases throughput, minimizes equipment downtime.
  • Silver-plated copper filler.
  • Good conductivity 0.060 ohm-cm.
  • Low VOCs.
  • Minimal shrinkage.
  • Heat cure silicone.
  • Flexible, 120 minute working life, > 450 psi lap shear strength, 24 hr handling time at room temperature, wide range of application temperatures. 1 week for full cure.
  • Non corrosive cure mechanism.
  • No corrosive by-products generated during curing to damage substrate.
  • Thick paste.
  • Can be used on overhead or vertical surfaces.