CHO-BOND 1030 4oz

CX50021030 000055


SKU: CX50021030 000055 Categories: ,

Description

CHO-BOND 1030 is a one component, silver plated, copper filled, electrically conductive silicone sealant

CHO-BOND 1030 Technical Data Sheet

Properties

Binder SILICONE
Filler Ag/Cu
Mix Ratio (by wgt.) 1-part
Consistency gritty paste
Specific Gravity 3.75 ±0.25
Minimum Lap Shear Strength, psi (MPa) 200 (1.38)
Minimum Die Shear* Strength, psi (MPa)
Maximum DC Volume Resistivity, ohm-cm 0.05
Use Temperature –67 to 392°F (–55 to 200°C)
Elevated Temperature Cure Cycle NA
Room Temperature Cure 1 wk.***
Working Life 0.5 hr.
Shelf Life, mos. 6
Coverage, in.2/lb. (cm2/g) 13,000 (18.5)
Recommended Thickness, in. (mm) 0.010 max. (0.25)
VOC, g/liter 0
* Alumina die on gold ** at -40°F (-40°C) NA Not Applicable