CHO-BOND 1035 is a one component, electrically conductive, silver plated, glass filled, silicone sealant
CHO-BOND 1035 is a silver-plated glass filled, onecomponent conductive silicone designed for use as a fillet, gap filler and seam sealant for electrical enclosures where EMI shielding or electrical grounding is required. Minimum recommended bond line for CHO-BOND 1035 is 0.007 inches (0.18 mm). The lightweight silver glass filler of CHO-BOND 1035 provides a low cost EMI shielding solution for a variety of commercial and military applications including applications where weight savings are critical. CHO-BOND 1035’s moisture cure silicone polymer system allows it to cure to the touch in 24 hours and provides a flexible, conductive and environmental seal over a wide range of application temperatures. For best adhesion results, CHO-BOND 1035 should be used in conjunction with CHO-SHIELD 1086 primer. Typical applications include man portable electronics, radar and communication systems, EMI vents, military ground vehicles, and shelters. However, due to its spherical shaped silver plated glass filler, CHO-BOND 1035 is not recommended for equipment or applications where the material will experience vibration.
|Typical Properties||Typical Values||Test Method|
|Mix Ratio, A : B (by weight)||1-part||N/A|
|Consistency||Thin Paste||N/A (Q)|
|Maximum DC Volume Resistivity||0.005 ohm-cm||CHO-95-40-5555* (Q/C)|
|Minimum Lap Shear Strength**||100 psi (689 kPa)||CHO-95-40-5300* (Q/C)|
|Minimum Peel Strength**||3.0 lb./inch (525 N/m)||CHO-95-40-5302* (Q/C)|
|Specific Gravity||1.9||ASTM D792 (Q/C)|
|Hardness||81 Shore A||ASTM-D2240 (Q)|
|Continuous Use Temperature||- 55 °C to 200 °C (-67 °F to 392 °F)||N/A (Q)|
|Elevated Temperature Cure Cycle||None||N/A|
|Room Temperature Cure||1 week***||N/A (Q)|
|Working Life||0.5 hour||N/A (Q)|
|Shelf Life, unopened||6 months @ 25°C (77°F)||N/A (Q)|
|Minimum thickness recommended||0.007 in (0.18 mm)||N/A|
|Maximum thickness recommended||0.125 in (3.18 mm)||N/A|
|Volatile Organic Content (VOC)||160 g/l||Calculated|
|Theoretical Coverage Area at 0.010” Thick per Pound (454 grams)||1450 in2 (9355 cm2)||N/A|
|Theoretical Coverage - Length of an 1/8” Diameter Bead per Pound (454 grams)||95 feet (29.0 m)||N/A|
Features and Benefits
- One component
- Easy to use, no weighing or mixing required.
- Silver plated glass filler
- Good Conductivity 0.050 ohm -cm Low cost ($/cc).
- Moisture cure silicone
- 30 minute working life, rapid skin formation, 24 hr handling time, requires no pressure during curing, wide range of application temperatures. 1 week for full cure.
- Light weight
- More coverage per gram of material, minimal weight added to assembly or vehicle.
- Non corrosive cure mechanism
- No corrosive by-products generated during curing to damage substrate.
- Thin paste
- Very easy to dispense, apply and spread.