CHO-BOND 1038 is a one component, silver plated, copper filled, electrically conductive, silicone sealant
CHO-BOND 1038 is a silver-plated copper filled, one-component conductive silicone. It is designed for use as a fillet, gap filler and seam sealant on electrical enclosures for EMI shielding or electrical grounding. Minimum recommended bond line for CHOBOND 1038 is 0.007 inches (0.18mm). In addition, CHO-BOND 1038 may be used for EMI gasket repair, bonding, and attachment in applications where moderate strength (less than 150 psi) is required. CHO-BOND 1038’s moisture cure silicone polymer system allows it to cure to the touch in 24 hours and provides a robust conductive and environmental seal over a wide range of application temperatures. For applications requiring zero volatile organic compounds (VOCs) or minimal shrinkage, Parker Chomerics offers a solvent free version of CHO-BOND 1038 called CHO-BOND 1121. For best adhesion results, CHO-BOND 1038 should be used in conjunction with CHOSHIELD 1086 primer. Typical applications include man portable electronics, radar and communication systems, EMI vents, military ground vehicles, and shelters.
|Typical Properties||Typical Values||Test Method|
|CHO-BOND 1038||CHO-BOND 1121|
|Mix Ratio, A : B (by weight)||1-part||N/A|
|Consistency||Medium Paste||N/A (Q)|
|Maximum DC Volume Resistivity||0.010 ohm-cm||CHO-95-40-5555*(Q/C)|
|Minimum Lap Shear Strength**||150 psi (1034 kPa)||CHO-95-40-5300*(Q/C)|
|Minimum Peel Strength**||4.0 lb./inch (700 N/m)||CHO-95-40-5302* (Q/C)|
|Specific Gravity||3.6||ASTM D792 (Q/C)|
|Hardness||80 Shore A||ASTM-D2240 (Q)|
|Continuous Use Temperature||- 55°C to 125°C (-67 °F to 257 °F)||N/A (Q)|
|Elevated Temperature Cure Cycle||None||N/A|
|Room Temperature Cure||1 week***||N/A (Q)|
|Working Life||0.5 hour||N/A (Q)|
|Shelf Life, unopened||6 months @ 25°C (77°F)||12 months @ 25°C (77°F)||N/A (Q)|
|Minimum thickness recommended||0.007 in (0.18 mm)||N/A|
|Maximum thickness recommended||0.125 in (3.18 mm)||N/A|
|Volatile Organic Content (VOC)||111 g/l||0 g/l||Calculated|
|Theoretical Coverage Area at 0.010” Thick per Pound (454 grams)||775 in2 (5000 cm2)||N/A|
|Theoretical Coverage - Length of an 1/8” Diameter Bead per Pound (454 grams)||50 feet (15.2 m)||N/A|
Features and Benefits
- One component
- Easy to use, no weighing or mixing required.
- Silver plated copper filler
- Excellent conductivity 0.010 ohm-cm
- Moisture cure silicone
- 30 minute working life, rapid skin formation, 24 hr handling time, requires no pressure during curing, wide range of application temperatures. 1 week for full cure.
- Non corrosive cure mechanism
- No corrosive by-products generated during curing to damage substrate.
- Medium paste
- Easy to dispense, apply and spread, can be used on overhead or vertical surfaces.
- No VOCs version: CHO-BOND 1121
- Minimal shrinkage, no permits or ventilation required.