CHO-BOND 1038 4oz

1075


SKU: CX50021038 000055 Categories: ,

Description

CHO-BOND 1038 4oz with 1086 primer is a one component, electrically conductive, silver plated, copper filled, silicone sealant

CHO-BOND 1038 Technical Data Sheet

 

Value Proposition

CHO-BOND 1038 is a silver-plated copper filled, one-component conductive silicone. It is designed for use as a fillet, gap filler and seam sealant on electrical enclosures for EMI shielding or electrical grounding. Minimum recommended bond line for CHOBOND 1038 is 0.007 inches (0.18mm). In addition, CHO-BOND 1038 may be used for EMI gasket repair, bonding, and attachment in applications where moderate strength (less than 150 psi) is required. CHO-BOND 1038’s moisture cure silicone polymer system allows it to cure to the touch in 24 hours and provides a robust conductive and environmental seal over a wide range of application temperatures. For applications requiring zero volatile organic compounds (VOCs) or minimal shrinkage, Parker Chomerics offers a solvent free version of CHO-BOND 1038 called CHO-BOND 1121. For best adhesion results, CHO-BOND 1038 should be used in conjunction with CHOSHIELD 1086 primer. Typical applications include man portable electronics, radar and communication systems, EMI vents, military ground vehicles, and shelters.

Properties

Typical Properties Typical Values Test Method
CHO-BOND 1038 CHO-BOND 1121
Polymer Silicone N/A
Filler Silver-Plated Copper N/A
Mix Ratio, A : B (by weight) 1-part N/A
Color Gray N/A (Q)
Consistency Medium Paste N/A (Q)
Maximum DC Volume Resistivity 0.010 ohm-cm CHO-95-40-5555*(Q/C)
Minimum Lap Shear Strength** 150 psi (1034 kPa) CHO-95-40-5300*(Q/C)
Minimum Peel Strength** 4.0 lb./inch (700 N/m) CHO-95-40-5302* (Q/C)
Specific Gravity 3.6 ASTM D792 (Q/C)
Hardness 80 Shore A ASTM-D2240 (Q)
Continuous Use Temperature - 55°C to 125°C (-67 °F to 257 °F) N/A (Q)
Elevated Temperature Cure Cycle None N/A
Room Temperature Cure 1 week*** N/A (Q)
Working Life 0.5 hour N/A (Q)
Shelf Life, unopened 6 months @ 25°C (77°F) 12 months @ 25°C (77°F) N/A (Q)
Minimum thickness recommended 0.007 in (0.18 mm) N/A
Maximum thickness recommended 0.125 in (3.18 mm) N/A
Volatile Organic Content (VOC) 111 g/l 0 g/l Calculated
Theoretical Coverage Area at 0.010” Thick per Pound (454 grams) 775 in2 (5000 cm2) N/A
Theoretical Coverage - Length of an 1/8” Diameter Bead per Pound (454 grams) 50 feet (15.2 m) N/A
 

Features and Benefits

  • One component
  • Easy to use, no weighing or mixing required.
  • Silver plated copper filler
  • Excellent conductivity 0.010 ohm-cm
  • Moisture cure silicone
  • 30 minute working life, rapid skin formation, 24 hr handling time, requires no pressure during curing, wide range of application temperatures. 1 week for full cure.
  • Non corrosive cure mechanism
  • No corrosive by-products generated during curing to damage substrate.
  • Medium paste
  • Easy to dispense, apply and spread, can be used on overhead or vertical surfaces.
  • No VOCs version: CHO-BOND 1121
  • Minimal shrinkage, no permits or ventilation required.

Ordering Information

Weight (grams) Packaging Part Number Primer Included
113.4 1.5 fluid ounce aluminum foil tube 50-02-1038-0000 1086
113.4 1.5 fluid ounce aluminum foil tube 50-02-1038-1000 No
227 2.5 fluid ounce SEMCO cartridge 50-33-1038-0000 No
454 6 fluid ounce SEMCO cartridge 50-01-1038-0000 1086
454 6 fluid ounce SEMCO cartridge 50-31-1038-0000 No