CHO-BOND 1075 10oz W/1086 Primer

1075


SKU: CX50011075 000055 Categories: ,

Description

CHO-BOND 1075 is a one-component, corrosion resistant, electrically conductive, silver plated, aluminum filled, silicone sealant

CHO-BOND 1075 Technical Data Sheet

Value Proposition

CHO-BOND 1075 is a silver plated aluminum filled, one-component conductive silicone designed for use as a fillet, gap filler and seam sealant on electrical enclosures for EMI shielding or electrical grounding. Minimum recommended bond line for CHOBOND 1075 is 0.010 inches (0.25mm). In addition, CHO-BOND 1075 may be used for EMI gasket repair, bonding, and attachment in applications where moderate strength (100 psi) is required. The silver aluminum filler of CHO-BOND 1075 provides excellent galvanic corrosion resistance when applied to aluminum substrates. No volatile organic compounds (VOCs) and minimal shrinkage upon curing make CHO-BOND 1075 a good choice for a variety of commercial and military applications. CHO-BOND 1075’s moisture cure silicone polymer system allows it to cure to the touch in 24 hours and provides a robust conductive and environmental seal over a wide range of application temperatures. For best adhesion results, CHO-BOND 1075 should be used in conjunction with CHOSHIELD 1086 primer. Typical applications include man portable electronics, radar and communication systems, EMI vents, military ground vehicles, and shelters.

Properties

Typical Properties Typical Values Test Method
Polymer Silicone N/A
Filler Silver-Plated Aluminum N/A
Mix Ratio, A : B (by weight) 1-part N/A
Color Gray N/A (Q)
Consistency Dry Medium Paste N/A (Q)
Maximum DC Volume Resistivity 0.010 ohm-cm CHO-95-40-5555*(Q/C)
Minimum Lap Shear Strength** 100 psi (689 kPa) CHO-95-40-5300*(Q/C)
Minimum Peel Strength** 4.0 lb./inch (700 N/m) CHO-95-40-5302* (Q/C)
Specific Gravity 2.0 ASTM D792 (Q/C)
Hardness 81 Shore A ASTM-D2240 (Q)
Continuous Use Temperature - 55 °C to 200 °C (-67 °F to 392 °F) N/A (Q)
Elevated Temperature Cure Cycle None N/A
Room Temperature Cure 1 week*** N/A (Q)
Working Life 0.25 hour N/A (Q)
Shelf Life, unopened 6 months @ 25°C (77°F) N/A (Q)
Minimum thickness recommended 0.010 in (0.25 mm) N/A
Maximum thickness recommended 0.125 in (3.18 mm) N/A
Volatile Organic Content (VOC) 0 g/l Calculated
Theoretical Coverage Area at 0.010” Thick per Pound (454 grams) 1375 in2 (8871 cm2) N/A
Theoretical Coverage - Length of an 1/8” Diameter Bead per Pound (454 grams) 90 feet (27.4 m) N/A
 

Features and Benefits

  • One component
  • Easy to use, no weighing or mixing required.
  • Silver plated aluminum filler
  • Excellent conductivity 0.010 ohm-cm outstanding galvanic corrosion resistance against aluminum substrates.
  • Moisture cure silicone
  • 30 minute working life, rapid skin formation, 24 hr handling time, requires no pressure during curing, wide range of application temperatures. 1 week for full cure.
  • No VOCs
  • Minimal shrinkage.
  • Moisture cure silicone
  • 15 minute working life, rapid skin formation, 24 hr handling time, requires no pressure during curing, wide range of application temperatures. 1 week for full cure.
  • Light weight
  • More coverage per gram of material, minimal weight added to assembly or vehicle.
  • Non corrosive cure mechanism
  • No corrosive by-products generated during curing to damage substrate.
  • Dry medium paste
  • Can be used on overhead or vertical surfaces.