CHO-BOND 2165 QT

2003


SKU: CX500421650000 30 Categories: ,

Description

CHO-BOND 2165 is a two component, corrosion resistant, electrically conductive, copper filled, polyurethane sealant

CHO-BOND 2165 Technical Data Sheet

Value Proposition

CHO-BOND® 2165 is a stabilized-copper filled, two-component polyurethane conductive sealant specifically designed for aerospace and military applications. CHO-BOND 2165 provides a conductive, corrosion resistant protective compound for aluminum and composite airframes used in conjunction with Parker Chomerics CHO-SHIELD 2000 series EMI coatings. CHO-BOND 2165 is a good compound choice for EMI shielding and electrical grounding applications. This thick conductive paste may be used as fastener fill, gap fill, or repair compound for aircraft. CHO-BOND 2165 achieves full properties in less than 4 hours with a combination room temperature cure plus a 125°C cure minimizing aircraft downtime. Due to material shrinkage, multiple applications may be necessary. CHO-BOND 2165 is designed to be used with CHO-SHIELD 1091 Primer, sold separately. For best adhesion results, CHO-BOND 1075 should be used in conjunction with CHOSHIELD 1086 primer. Typical applications include man portable electronics, radar and communication systems, EMI vents, military ground vehicles, and shelters.

Properties

Typical Properties Typical Values Test Method
Polymer Polyurethane N/A
Filler Stabilized Copper N/A
Mix Ratio, A : B (by weight) 100 : 7 N/A
Color Brownish Red N/A (Q)
Consistency Thick Paste N/A (Q)
Maximum DC Volume Resistivity (Cure Cycle 1) 0.010 ohm-cm MAT-1003* (Q/C)
Minimum Lap Shear Strength** (Cure Cycle 1) 120 psi (827 Kpa) CHO-95-40-5300*(Q/C)
Minimum Peel Strength** (Cure Cycle 1) 1.9 lb./inch (333 N/m) CHO-95-40-5302* (Q)
Specific Gravity (Cure Cycle 1) 2.9 ASTM D792 (Q/C)
Hardness (Cure Cycle 1) 70 Shore A ASTM-D2240 (Q/C)
Continuous Use Temperature - 65 °C to 85 °C (-85 °F to 185 °F) N/A (Q)
Elevated Temperature Cure Cycle Cure Cyle Option 1: 0.25 hour @ 113°C (235°F) Cure Cyle Option 2: 2.0 hours @ 65°C (150°F) N/A (Q)
Room Temperature Cure 1 week*** N/A (Q)
Working Life 1.0 hour N/A (Q)
Shelf Life, unopened 9 months @ 25°C (77°F) N/A (Q)
Minimum thickness recommended 0.004 in (0.10 mm) N/A
Maximum thickness recommended 0.060 in (1.52 mm) N/A
Volatile Organic Content (VOC) 207 g/l Calculated
Theoretical Coverage Area at 0.010” Thick per Pound (454 grams) 900 in2 (5806 cm2) N/A
Theoretical Coverage - Length of an 1/8” Diameter Bead per Pound (454 grams) 60 feet (18.3 m) N/A
 

Features and Benefits

 
  • Two component
  • Mix ratio by weight A:B (100: 7), working life doesn’t start until the two components are mixed.
  • Stabilized copper filler
  • Excellent conductivity 0.010 ohm-cm, very good corrosion resistance, Survives 2,000 hour in salt spray (MIL-STD-810) against a 6060-T6 aluminum substrate with a MIL-DTL-5541, Type II, Class 3 chromate.
  • Polyurethane
  • Accelerated heat cure, aircraft fluid resistance, compatible with Parker Chomerics CHO-SHIELD 2000 Series Coatings, can be painted over.
  • Chromate free
  • Environmentally friendly.
  • Thick paste
  • Can be used on overhead or vertical surfaces.