THERM-A-FORM T644 200cc Kit

65-01-1641-0000 NP


SKU: CX6500T644 0200 Categories: ,

Description

THERM-A-FORM T644 is a two component, pink silicone, boron nitride, thermally conductive elastomer

Therm-A-Form Technical Data Sheet

Value Proposition

THERM-A-FORM thermally conductive silicone elastomer products are dispensable formin- place compounds designed for heat transfer without excessive compressive force in electronics cooling applications. These versatile liquid reactive materials can be dispensed and then cured into complex geometries for cooling of multi-height components on a PCB without the expense of a molded sheet. Each compound is available in ready-to-use cartridge systems, eliminating weighing, mixing, and degassing procedures.

Properties

Typical Properties Product Test Method
Physical Color Select a product from the right column to view specs here Visual
Binder --
Filler --
Number of Components --
Mix Ratio --
Specific Gravity ASTM D792
Hardness, Shore A ASTM D2240
Viscosity, poise ASTM D2196
Pot Life, minutes Time to 2X Starting Viscosity at 23 °C
Cure Cycles Chomerics
Brittle Point, °F (°C) ASTM D2137
Extractable Silicone, % Chomerics
Thermal Thermal Conductivity, W/m-K ASTM D5470
Heat Capacity, J/g-K ASTM E1269
Coefficient of Thermal Expansion, ppm/K ASTM E831
Operating Temperature Range,°F (°C) --
Electrical Dielectric Strength, KVAC/mm (VAC / mil) ASTM D149
Volume Resistivity, ohm-cm ASTM D257
Dielectric Constant @1,000 kHz ASTM D150
Dissipation Factor @ 1,000 kHz Chomerics
Regulatory Flammability Rating (See UL File E140244) UL 94
RoHS Compliant Chomerics Certification
Outgassing, % TML (%CVCM) ASTM E595
Shelf Life, months from date of manufacture Chomerics
 

Features and Benefits

  • Dispensable form-in-place gap filling, potting, sealing, and encapsulating
  • Excellent blend of high thermal conductivity, flexibility, and ease of use
  • Conformable to irregular shapes without excessive force on components
  • Ready-to-use cartridge system eliminates weighing, mixing, and de-gassing steps
  • Variety of kit sizes and configurations available to suit any application (handheld twin-barrel cartridges, Semco® tubes, and pneumatic applicators)
  • Vibration damping

Product Attributes

1641

  • One-component moisture-cure RTV, supplied with primer 1086 (primer is not required for cure but promotes adhesion)
  • Non-acetic acid generating

1642

  • General duty, economical thermal solution
  • Two-component thermally conductive encapsulant/sealant/caulk/potting compound, supplied with primer 1087. (primer is not required for cure but promotes adhesion)

T642

  • High thermal performance with flexibility
  • Ideal for underfilling
  • Low outgassing

T644

  • Very low modulus material for transferring heat from fragile electronic components

T646

  • Provides combination of high thermal performance and low cost

T647

  • Superior thermal performance while maintaining low modulus
  • Flows into complex geometries to maintain intimate contact with components