CHO-BOND 1030 4oz

CHO-BOND 1030 4oz

SKU: CX50021030 0000

  • CHO-BOND 1030 is a one component, silver plated, copper filled, electrically conductive silicone adhesive

  • CHO-BOND 1030 is a silver plated copper filled, one-component conductive silicone designed for applications where a flexible, strong, conductive electrical bond must be achieved. CHO-BOND 1030 greatly simplifies the problem of bonding conductive silicone EMI gaskets to metal substrates. It is formulated for relatively small bond lines (less than 0.010 inches (0.25mm)), and should not be used as an EMI caulk where bond lines are greater than 0.10 inches (0.25 mm). No volatile organic compounds (VOCs) and minimal shrinkage upon curing make CHO-BOND 1030 a good choice for a variety of commercial and military applications. CHOBOND 1030’s moisture cure silicone polymer system allows it to cure to the touch in 24hrs and provides a robust conductive bond over a wide range of application temperatures. For best adhesion results, CHO-BOND 1030 should be used in conjunction with CHOSHIELD 1086 primer. Typical applications include bonding, repair, and attachment of EMI gaskets, and sealing around EMI vents and windows.

  • Typical Properties

    Typical Values

    Test Method

    Polymer

    Silicone

    N/A

    Filler

    Silver-Plated Copper

    N/A

    Mix Ratio, A : B (by weight)

    1-part

    N/A

    Color

    Light Gray

    N/A (Q)

    Consistency

    Medium Paste

    N/A (Q)

    Maximum DC Volume Resistivity

    0.005 ohm-cm

    CHO-95-40-5555*(Q/C)

    Minimum Lap Shear Strength**

    200 psi (1379 kPa)

    CHO-95-40-5300*(Q/C)

    Minimum Peel Strength**

    8.0 lb./inch (876 N/m)

    CHO-95-40-5302* (Q/C)

    Specific Gravity

    3.8

    ASTM D792 (Q/C)

    Hardness

    77 Shore A

    ASTM-D2240 (Q)

    Continuous Use Temperature

    – 55°C to 200°C (-67 °F to 392 °F)

    N/A (Q)

    Elevated Temperature Cure Cycle

    None

    N/A

    Room Temperature Cure

    1 week***

    N/A (Q)

    Working Life

    0.5 hour

    N/A (Q)

    Shelf Life, unopened

    6 months @ 25°C (77°F)

    N/A (Q)

    Minimum thickness recommended

    N/A

    N/A

    Maximum thickness recommended

    0.010 in (0.25 mm)

    N/A

    Volatile Organic Content (VOC)

    0 g/l

    Calculated

    Theoretical Coverage Area at 0.010” Thick per Pound (454 grams)

    775 in2 (5,000 cm2)

    N/A

    Theoretical Coverage – Length of an 1/8” Diameter Bead per Pound

    50 feet (15.2 m)

    N/A

    • One component
    • Easy to use, no weighing or mixing required.
    • Silver-plated copper filler
    • Good conductivity 0.050 ohm-cm.
    • No VOCs
    • Minimal shrinkage.
    • Moisture cure silicone
    • Flexible, 30-minute working life, rapid skin formation, > 200 psi lap shear strength, 24 hr handling time, a wide range of application temperatures. 1 week for full cure.
    • Noncorrosive cure mechanism
    • No corrosive by-products generated during curing to damage substrate.
    • Medium paste
    • Can be used on overhead or vertical surfaces.