THERM-A-GAP Gel 30 30cc Cartridge

SKU: CX6500GEL30 0030
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THERM-A-GAP Gel 30 is a pink, easily dispensable, fully cured, low thermal impedance, high track surface gel
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Parker Chomerics fully cured dispensable GELs eliminate time-consuming hand assembly, decreasing installation costs and reducing customer manufacturing and purchasing (logistical) complexity. These products require no mixing or curing, providing superior design flexibility.
- Provides low thermal impedance at thin and thick gaps, allowing use of common heat spreaders
- Proven reliability of extreme temperature cycling and shock & vibration
- Deflects easily under very low compressive forces, decreasing stress on components thus decreasing component failures.
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Typical Properties
Product
Test Method
Physical
Color
Select product from right column to view specs here
Visual
Flow Rate, grams/min – 30cc syringe with no tip attachment 0.100” orifice, 90psi (621 kPa)
Chomerics
Specific Gravity
ASTM D792
Modified ASTM C165 Dispensed 1.0 cc of material Brought 1” x 1” probe down to 0.100” Test rate 0.025 in/min
Typical minimum bondline thickness, in (mm)
Chomerics
Thermal
Thermal Conductivity, W/m-K (needs elaboration)
ASTM D5470
Heat Capacity, J/g-K
ASTM E1269
Coefficient of Thermal Expansion, ppm/K
ASTM E831
Operating Temperature Range, °F (°C)
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Electrical
Dielectric Strength, VAC / mil (KVAC/mm)
ASTM D149
Volume Resistivity, ohm-cm
ASTM D257
Dielectric Constant @100 kHz
ASTM D150
Dissipation Factor @ 100 kHz
Chomerics
Regulatory
Flammability Rating
UL 94
RoHS Compliant
Chomerics Certification
Outgassing, % TML (CVCM)
ASTM E595
Shelf Life, months from date of manufacture
Chomerics
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- Easily dispensable
- Fully-cured / No pump out
- High bulk thermal conductivity
- Low thermal impedance
- Ultra low compression force
- High tack surface & reworkable
- Proven long-term reliability
Typical Applications
- Automotive Electronic Control Units (ECUs)
- Power Supplies & Semiconductors
- Memory & Power Modules
- Microprocessors / Graphics Processors
- Flat Panel Displays & Consumer Electronics
Product Attributes
GEL 8010
- Thin bond line gel (approximately 2-10 mils)
- Low thermal impedance gel
- Stencil printable with no pump out
- Ideal for high-volume dispensing
- Proven long-term reliability
GEL 30/GEL 30G
- Accommodates a variety of bond line thicknesses for application to multiple devices
- GEL 30/GEL 30G has been successfully used to fill a variety of different gap thicknesses. Please reference the GEL 30/GEL 30G Reliability test report for additional details and surface recommendations.
- High Bulk Thermal Conductivity
- Excellent performance-to-price
- Compatible with high volume, automated dispense processes
- Meets Telcordia (Bellcore) silicone specifications
- “G” version has 0.010” glass beads as compression stops for electrical isolation
Installation Guidelines
Thermal gels are supplied in plastic syringes and aluminum cartridges. Apply pressure to the rear of the cartridge, simply dispense the desired amount onto components or cooling plates. The gel is reworkable and excess material can be easily wiped off. Since GEL 8010 gel is conformable, the gel can be stencil printed onto the plates. The thickness of the printed gel can be adjusted depending on the component type and size, but about 6mil thickness is recommended.
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6W
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5 = Standard Packaging
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THERM-A-GAP GEL 8010, GEL 30 & GEL30G
GEL 30/GEL 30G
0300 = 300cc Aluminum Cartridge (Caulking Style)
9 = Custom Configuration
11
33579
GEL 8010 = 1 Gallon Pail (2800cc, 7.6Kg)*
28020
GEL 30 = 1 Gallon Pail (2800cc, 9Kg)*
Custom Part Number
THERM-A-GAP GEL Material Code GEL 8010 & GEL 30