Parker Chomerics fully cured dispensable GELs eliminate time-consuming hand assembly, decreasing installation costs and reducing customer manufacturing and purchasing (logistical) complexity. These products require no mixing or curing, providing superior design flexibility.
Provides low thermal impedance at thin and thick gaps, allowing use of common heat spreaders
Proven reliability of extreme temperature cycling and shock & vibration
Deflects easily under very low compressive forces, decreasing stress on components thus decreasing component failures.
Accommodates a variety of bond line thicknesses for application to multiple devices
GEL 30/GEL 30G has been successfully used to fill a variety of different gap thicknesses. Please reference the GEL 30/GEL 30G Reliability test report for additional details and surface recommendations.
High Bulk Thermal Conductivity
Compatible with high volume, automated dispense processes
“G” version has 0.010” glass beads as compression stops for electrical isolation
Thermal gels are supplied in plastic syringes and aluminum cartridges. Apply pressure to the rear of the cartridge, simply dispense the desired amount onto components or cooling plates. The gel is reworkable and excess material can be easily wiped off. Since GEL 8010 gel is conformable, the gel can be stencil printed onto the plates. The thickness of the printed gel can be adjusted depending on the component type and size, but about 6mil thickness is recommended.