THERM-A-GAP Gel 30 30cc Cartridge

• Easily dispensable
• Fully-cured / No pump out
• High bulk thermal conductivity
• Low thermal impedance
• Ultra low compression force
• High tack surface & reworkable
• Proven long-term reliability

Typical Applications

• Automotive Electronic Control Units (ECUs)
• Power Supplies & Semiconductors
• Memory & Power Modules
• Microprocessors / Graphics Processors
• Flat Panel Displays & Consumer Electronics

Product Attributes

GEL 8010

• Thin bond line gel (approximately 2-10 mils)
• Low thermal impedance gel
• Stencil printable with no pump out
• Ideal for high-volume dispensing
• Proven long-term reliability

GEL 30/GEL 30G

• Accommodates a variety of bond line thicknesses for application to multiple devices
• GEL 30/GEL 30G has been successfully used to fill a variety of different gap thicknesses. Please reference the GEL 30/GEL 30G Reliability test report for additional details and surface recommendations.
• High Bulk Thermal Conductivity
• Excellent performance-to-price
• Compatible with high volume, automated dispense processes
• Meets Telcordia (Bellcore) silicone specifications
• “G” version has 0.010” glass beads as compression stops for electrical isolation

Installation Guidelines

Thermal gels are supplied in plastic syringes and aluminum cartridges. Apply pressure to the rear of the cartridge, simply dispense the desired amount onto components or cooling plates. The gel is reworkable and excess material can be easily wiped off. Since GEL 8010 gel is conformable, the gel can be stencil printed onto the plates. The thickness of the printed gel can be adjusted depending on the component type and size, but about 6mil thickness is recommended.