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Chomerics Pad 60

Thermal Interface Materials

Therm-a-Gap PAD

THERM-A-GAP PAD 60

High-performance thermal gap filler pad — 6.0 W/m·K, soft and conformable for general-purpose electronics cooling without sacrificing reliability.

Thermal conductivity

6.0

W/m·K

Hardness

40

Shore 00

Density

3.2

g/cc

Operating temp

−40 to 125

°C

We convert and kit Parker Chomerics materials. Contact KraFAB for die-cut parts, custom thicknesses, or kitted assemblies.

Chomerics Pad 60

Why Pad 60

A dependable, soft thermal pad for the bulk of your designs.

Pad 60 is the thermally conductive gap filler that engineers have been asking for. It is an ideal combination of 6.0 W/m·K conductivity, Shore 00/40 softness, and a naturally tacky surface that installs in seconds. It’s the pad most engineers reach for when they need reliable thermal management without specifying an aerospace-grade material.

6.0 W/m·K thermal conductivity for demanding heat-paths
Naturally tacky surface — single-sided application without adhesive
Available in thicknesses 0.020" to 0.250" (0.5–6.35 mm)
UL 94 V-0 flammability rated
Soft Shore 00/40 — conforms to uneven surfaces with low mounting stress
Reworkable and clean-release
Standard 9" × 9" sheets, custom die-cut parts on request
RoHS and REACH compliant, halogen-free

Applications

Where engineers are specifying it

Telecom, power electronics, industrial compute, and consumer devices — where
reliable conduction and easy assembly matter most.

Consumer & industrial electronics

Between CPUs/SoCs and heat sinks where reliable conduction and easy assembly matter.

Telecom & networking gear

Switches, routers, and base-station boards with mixed component heights and high-flux ASICs.

Power supplies & inverters

Thermal paths from MOSFETs, IGBTs, and transformer cores to chassis or finned heat sinks.

Automotive infotainment & ADAS

Softness & conformability protect solder joints under thermal cycling and vibration.

LED lighting & displays

Thin pads draw heat from driver boards and high-power LED arrays to housings.

Servers & data centers

Memory modules, NVMe drives, and accelerator cards with frequent rework requirements.

vs. the rest of the family

How Pad 60 stacks up in the Therm-a-Gap family.

Pad 60 Pad 80 Pad 80LOE
Thermal conductivity 8.0 W/m·K 8.0 W/m·K
Hardness 55 Shore 00 30 Shore 00
Outgassing (CVCM) 0.5 % ≤ 0.10 %
Best for Max conduction Sealed / aerospace

Specifications

Full datasheet, in your browser.

Get a Quote

Ready to spec Pad 60 into your build?

KraFAB die-cuts, kits, and ships Parker Chomerics thermal materials worldwide. Quick-turn prototypes and production volumes from the same line.

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