Thermal Interface Materials
Therm-a-Gap PAD
THERM-A-GAP PAD 80LOE
Next-generation low-outgassing thermal gap filler pad — 8.0 W/m·K, soft, conformable, designed for sealed and weight-sensitive electronics.
Thermal conductivity
8.0
W/m·K
Hardness
30
Shore 00
Density
2.6
g/cc
Operating temp
−40 to 150
°C
We convert and kit Parker Chomerics materials. Contact KraFAB for die-cut parts, custom thicknesses, or kitted assemblies.
Therm-a-Gap PAD
The first low-outgassing pad that doesn’t compromise on conduction.
Earlier-generation low-outgassing pads topped out around 3–4 W/m·K. PAD 80LOE matches the thermal performance of Parker’s flagship Pad 80 with a fraction of the volatile content — letting you put a real thermal interface inside hermetic enclosures, optical assemblies, and weight-sensitive avionics.
Applications
Where engineers are specifying it
Sealed assemblies, weight-sensitive electronics, and high-flux devices that need a soft,
conformable interface.
Avionics & space electronics
Sealed enclosures where outgassing must not contaminate optics, sensors, or coatings.
ADAS & EV power electronics
High-flux IGBTs and BMS modules in tight stacks — soft pad protects solder joints under vibration.
5G & telecom RRUs
Heat path from PA modules to chassis with conformability across uneven die heights.
Industrial drives & robotics
High operating temperature over multi-year service life.
Defense compute & C5ISR
Hardened SBC in airtight chassis — low CVCM keeps optical windows clean.
Specifications
Full datasheet, in your browser.
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Ready to spec Pad 80LOE into your build?
KraFAB die-cuts, kits, and ships Parker Chomerics thermal materials worldwide. Quick-turn prototypes and production volumes from the same line.