TC50 is a RoHS-compliant material designed to accommodate today’s high-performance electronics. It is specifically suitable for volume markets because of its ease of dispensing.
In robotics and automation, the ability to distribute TC50 efficiently will result in reduced cycle times and therefore will reduce production costs.
THERM-A-GAP TC50 benefits include:
- High Thermal Conductivity
- Ease in Handling/Dispensing
- Ideal for High-Volume Applications
- Accommodates a variety of Bond Line Applications
THERM-A-GAP TC50 is best suited for:
- Electronic Control Units (ECU’s)
- Consumer Electronics
- Power Supplies and Semiconductors
- Memory and Power Modules
TC50 does not require commonly used spreaders because of low thermal impedance at multiple gaps. It also requires minimal force in order to conform during assembly. This greatly minimizes stress to components and solder joints.
For ease in application, TCU50 can be packaged in syringes, cartridges, or bulk packaged in pails. With a thermal conductivity of 5.0 W/m-K and a heat capacity of 1 J/g-K, it is typically suitable for all bond lines over .15mm (0.006 in.) thick.