Thermal Interface Materials
Therm-a-Gap PAD
THERM-A-GAP PAD 120LOE
12.0 W/m-K low oil bleed, low relaxation force thermal gap filler pad for mission-critical and high-performance electronics.
Thermal conductivity
12.0
W/m·K
Hardness
45
Shore 00
Thickness
1 to 5
mm standard
Flammability
V-0
UL 94
Therm-a-Gap PAD
High thermal performance with very low oil bleed and migration.
Introducing Parker Chomerics THERM-A-GAP PAD 120LOE, a high-performance thermal gap filler pad delivering 12.0 W/m-K thermal conductivity with very low silicone oil bleed and migration. Designed for reliable, long-term thermal management in mission-critical and high-performance electronics, PAD 120LOE helps address applications where silicone oil bleed may create aesthetic or manufacturing concerns.
With a hardness of Shore 00 45 and excellent stress relaxation over time, PAD 120LOE imparts minimal stress on components such as integrated circuits and provides vibration dampening while maintaining effective thermal contact across uneven gaps and rough surfaces.
Earlier-generation low-outgassing pads topped out around 3–4 W/m·K. PAD 80LOE matches the thermal performance of Parker’s flagship Pad 80 with a fraction of the volatile content — letting you put a real thermal interface inside hermetic enclosures, optical assemblies, and weight-sensitive avionics.
Applications
Where engineers are specifying it
Mission-critical and high-performance electronics where silicone oil bleed is a concern.
Advanced Computing
High-performance processors and modules that need 12.0 W/m·K conduction without oil migration.
Defense Electronics
Long-term, high-reliability thermal management for mission-critical systems.
Telecommunications Infrastructure
Conformable heat path across uneven gaps and rough surface textures.
Automotive Modules
Soft pad minimizes stress on ICs and provides vibration dampening.
Specifications
Full datasheet and reliability data
Datasheet, reliability test report, and the Parker Chomerics Thermal Interface Materials Catalog.
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