Chomerics CHO-BOND
Parker offers a range of bonding adhesives that use acrylic, epoxy and urethane technologies designed to endure exposure to environmental conditions with the ability to bond substrates including bare metal, painted metal, composite, rubber-to-substrate, and more.
KraFAB CHO-BOND products
CHO-BOND 584-29
Two Component easy to use conductive Epoxy Adhesive
Parker Chomerics CHO-BOND® 584-29 conductive adhesive is a two-component, silver-filled epoxy formulated for thin bond lines and where precise application is required. CHO-BOND® 584-29 is a silver-colored epoxy designed to be used in very tight applications and around electrical components.
Features and Benefits
- Silver filler is a premium conductivity solution to electrical bonding
- Excellent conductivity levels (0.002 ohm-com)
- Strong adhesion properties (>1200 PSI lap shear strength)
- Thin paste makes it effective for easy dispensing from a small needle for small cracks and voids
- Fast cure at elevated temperatures (15 minutes at 113°C) and room temperature cure options
- Low volatile organic compounds
- Comes in standard sizes of pre-measured syringes so no mixing and measuring is required
Typical Applications
- Electrical enclosure bonding
- Electrical component grounding
- Cold soldering
- Sealing and bonding machined enclosures
CHO-BOND 592
Conductive Epoxy Adhesive
Two component silver filled epoxy conductive adhesive. CHO-BOND 592 provides excellent adhesion and good electrical conductivity. The long pot life, room temperature cure option, and ability to be thinned for spray applications proves application flexibility. Typical applications include EMI shielding, grounding, microwave modules and components, and circuit board repair.
Features and Benefits
- Long pot life (4-6 hours at 25°C allows for application flexibility
- Room temperature curing available
- Excellent thermal properties (low thermal impedance and good thermal shock resistance)
- Can be thinned for spray applications
- Good electrical conductivity (0.05 ohm-cm)
- Great adhesion strength (1500 PSI lap shear)
Typical Applications
- Sealant for microwave modules and components
- Circuit board repair
- Grounding applications
- EMI shielding applications
CHO-BOND 1018
Electrically Conductive Nickel-Aluminum Polythioether Sealant
Parker Chomerics CHO-BOND 1018 is a nickel-aluminum filled, two-component electrically conductive polythioether designed for use as a fillet, gap filler and seam sealant on electrical enclosures for EMI shielding.
Product Features:
- Outstanding EMI shielding
- Excellent galvanic corrosion resistance against aluminum substrates
- Silicone-free and easily paintable
- Packaged in a pre-measured kit
- Lightweight solution
- More coverage per gram of material, minimal weight added to assembly or vehicle
- Suitable for overhead and vertical surfaces
Typical Applications
- Ballistics and guided weaponry
- Ground/transport vehicles
- Military shelters and containers
- * Planes, drones, helicopters
- Defense radar systems
- Applications where corrosion resistance is necessary combined with exposure to fuels and fluids
CHO-BOND 1019
Silver-Plated Aluminum Filled Polythioether Electrically Conductive Sealant
Parker Chomerics CHO-BOND 1019 is a silver-plated aluminum filled electrically conductive polythioether sealant designed to be used in harsh environments due to its excellent fluid and fuels resistance.
Product Features:
- Good EMI shielding
- Excellent galvanic corrosion resistance against aluminum substrates
- Silicone free, easily paintable
- Packaged in a pre-measured kit
- No weighing required, mix and dispense in same package, minimizes process scrap
- Lightweight
- More coverage per gram of material, minimal weight added to assembly or vehicle
- For overhead or vertical surfaces
Typical Applications
- Ballistics and guided weaponry
- Ground/transport vehicles
- Military shelters and containers
- Planes, drones, helicopters
- Defense radar systems
- Applications where corrosion resistance is necessarily combined with exposure to fuels and fluids
CHO-BOND 1030
One Component Flexible Electrically Conductive Silicone Adhesive
Parker Chomerics CHO-BOND® 1030 cond ictive adhesive is a one component silver-plated copper filled silicone ideal for thin bond lines and bonding silicone EMI gaskets to metal substrates. CHO BONDS 1030 is a light grey colors silicone paste that is predominantly used for bonding elastomer gaskets
Features and Benefits
- One component system so no mixing or measuring required
- Silver-plated copper filler is a low cost solution to electrical bonding
- Good conductivity levels (0.050 ohm-cm)
- Moderate adhesion properties (>200 PSI lap shear strength)
- Medium paste consistency means it can be used on overhead or vertical surfaces
- No volatile organic compounds and no corrosive by-products generated when curing
Typical Applications
- Sealing of EMI vents and windows
- Bonding. repair, and attachment of EMI gaskets
CHO-BOND 1038
Silver-Plated Copper Filled Silicone Electrically Conductive Sealant
Parker Chomerics CHO BOND® 1038 is a one component, silver-plated copper filled sealant formulated to serve as gap filler for EMI shielding or electrical ground.ng. CHO BOND® 1038 is a gray-colored silicone that is ideally used for filling gaps but can also serve as a repair or bonding agent for elastomer gaskets where moderate strength (150 PSI lap shear strength) is required. CHO-BOND® 1121 has identical properties to CHO BOND® 1038 with the exception of VOC content and shelf life (1121 no VOCs and 12 month shelf life)
Features and Benefits
- One-component system so no mixing or measuring required
- Excellent electrical conductivity levels (0.010 ohm-cm)
- No corrosive by products generated during drying
- Medium consistency paste makes the material easy to dispense in overhead or vertical applications
- Volatile Organic Compound-free (VOC-free) version available (CHO-BOND® 1121)
- Working time of 30 minutes and can be handled in 24 hours
- No pressure required when curing to achieve bond
Typical Applications
- Man portable electronics
- Radar and Communication Systems
- EMi vents
- Military Ground Vehicles
- Military Shelters
CHO-BOND 1075
Silver-Plated Aluminum Filled Silicone Electrically Conductive Sealant for Corrosion Resistance
Parker Chomerics CHO BOND® 1075 is a one component, silver-plated aluminum filled sealant formulated to resist galvanic corrosion on aluminum substrates while providing excellent shielding and conductivity. CHO BOND® 1075 is a gray-colored silicone that is ideally used for filling gaps but can also serve as a repair or bonding agent for elastomer gaskets where moderate strength (100 PSI lap shear strength) is required.
Features and Benefits
- One-component system so no mixing or measuring required
- Excellent electrical conductivity levels (0.010 ohm-cm)
- Outstanding galvanic corrosion resistance against aluminum substrates
- No corrosive by-products generated during drying
- No volatile organic compounds (VOCs)
- Medium consistency paste makes the material dispensable in overhead or vertical applications
- No pressure required when curing to achieve proper bonding
Typical Applications
- Man-portable electronics
- Radar and Communication Systems
- EMI vents
- Military Ground Vehicles
- Military Shelters
CHO-BOND 1085
Silicone Adhesive Primers
Air drying liquid Silicone Adhesive Primer used to improve adhesion between CHO-BOND compounds to metal and other substrates. CHO-BOND 1085 is formulated to achieve maximum adhesion between non-silicone substrates for CHO-BOND 1029 adhesive.
Features/Benefits
- Easy to apply
- Clear in color
- Creates a secure, maximum bond
- Works on a variety of substrates
CHO-BOND 1086
Silicone Adhesive Primer
Air drying liquid Silicone Adhesive Primer used to improve adhesion between CHO-BOND compounds to metal and other substrates. CHO-BOND 1086 is formulated for use with several CHO-BOND adhesives including 1016, 1030, 1035, 1075 and more.
Features/Benefits
- Easy to apply
- Clear in color
- Creates a secure, maximum bond
- Works on a variety of substrates
- Variety of packaging options available
CHO-BOND 2165
Copper Filled Polyurethane Electrically Conductive Sealant for Corrosion Resistance
Parker Chomerics CHO BONDS 2165 is a two component, stabilized copper filled sealant specifically formulated for Aerospace and Military applications. CHO BOND® 2165 is a brownish-red colored polyurethane that is often used in conjunction with CHO-SHIELDs 2000 series EMI coatings to serve as a repair kit for military aircraft.
Features and Benefits
- Excellent electrical conductivity (0.010 ohm-cm)
- Very good corrosion resistance on aluminum substrates
- Aircraft fluid resistance
- Chromate free making it environmentally friendly
- Thick paste can be used on overhead or vertical surfaces
- Elevated temperature cure option (15 minutes at 113°C) as well as room temperature cure option
Typical Applications
- Aircraft fastener fill
- Gap Filler
- Aircraft repair compound
CHO-BOND 4660
Silver-Plated Copper Filled Polyisobutylene Electrically Conductive Sealant
Parker Chomerics CHO BOND® 4660 is a one-component, silver-plated copper filled conductive sealant specifically formulated for flexibility in applications where vibration resistance is required. CHO BOND® 4660 is a black -colored material that possesses identical properties of CHO BOND8 4669 except for a shortened working life
Features and Benefits
- One component system so no mixing or measuring required
- Good conductivity levels (0.080 ohm-com)
- No corrosive by-products generated during drying
- No primer required
- Excellent impermeability to gases
- Minimal weight added to assembly due to lightweight material
- Easily dispensed using a standard caulking gun
Typical Applications
- Access panels
- Shielded room joints
- Temporary military shelters
- Hardware
- Bulkhead feed-through fittings
- Building conduits
