Resin Designs
Resin Designs products are engineered for innovation, performance, and reliability across demanding industries including aerospace, automotive, defense, and telecommunications. Made in the USA and distributed globally, their portfolio includes advanced adhesives, conductive silicones, thermal interface materials, and EMI shielding solutions tailored for cutting-edge applications.
As a leading manufacturer of adhesives and sealants, Resin Designs supports critical functions such as semiconductor packaging, EMI shielding, grounding, thermal management, and electronic assembly integration.
Our dedicated team works closely with clients to develop customized solutions that meet the most stringent environmental and performance standards.
Explore Resin Designs Solutions
Conductive Grounding Gaskets
Designed for electrical continuity and EMI grounding in aerospace and defense enclosures. These gaskets combine durable silicone elastomers with conductive fillers to ensure low impedance connections.
Shielding Gaskets
These EMI shielding gaskets deliver reliable protection from electromagnetic interference while maintaining environmental seals, ideal for high-frequency electronics and military-grade applications.
Gel Rope Gaskets
Flexible, self-healing cured silicones in rope form, designed for high-performance EMI shielding and sealing. Widely used in avionics, connectors, and enclosures.
Materials and Products
Thermal Interface Materials
These ceramic-filled, thermally conductive systems feature organic or silicone binders, optimized for heat transfer in high-density electronics and aerospace assemblies.
GelTek Silicones
GelTek materials offer exceptional flexibility and thermal conductivity. These silicone-based materials are suitable for gap filling and EMI shielding in compact or irregular geometries.
Thermal Gap Pads
These compressible, cured silicone pads integrate thermally conductive ceramics to enhance heat transfer. Ideal for high-power devices and tight-packaging requirements.
Conductive Gaskets
Blending metal mesh or rope conductivity with silicone sealing properties, these gaskets offer EMI shielding and grounding in a single solution. Key applications include avionics, military enclosures, and high-performance electronic systems.
Sealing Strips and Grommets
Cold-applied like traditional tape but sealing like a potting compound, these products offer re-entrance capability and high-performance sealing for connectors and housings.
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Meets BMS8-397 specification
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Used in Boeing and Airbus cabin floor sealing
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Available in custom slit or die-cut formats
Featured Blog Content
Resin Designs Gel Rope Gaskets vs. GelTek: Choosing the Right EMI Solution with KraFAB
Resin Designs Gel Rope Gaskets vs. GelTek: Choosing the Right EMI Solution with KraFAB When it comes to EMI shielding and environmental sealing, Resin Designs’ Gel Rope Gaskets and GelTek materials both stand out as high-performance, silicone gel-based solutions. Each offers distinct advantages based on the specific application, and KraFAB proudly supplies both technologies to […]
Meeting Aerospace Standards with Resin Designs Conductive Solutions
Aerospace-Grade Reliability: Resin Designs Conductive Materials for Extreme Conditions In the aerospace industry, where precision, reliability, and safety are paramount, materials must meet stringent specifications to ensure performance in extreme conditions. Resin Designs’ line of electrically conductive materials is engineered to meet and exceed the rigorous demands of aerospace applications, offering advanced solutions that comply […]
Thermal Interface Materials vs. Conductive Adhesives in Aerospace: When to Use Each
TIMs and ECAs in Aerospace In compact aerospace systems, effective thermal management and electrical continuity are crucial to maintaining reliability and performance. With increasing miniaturization and power density, choosing the right material—thermal interface material (TIM) or electrically conductive adhesive (ECA)—can have a significant impact on mission success. Here we explore the differences between these two […]