Chomerics Therm-A-Gap Gel 75
There is an amazing new option in a low stress, one size fits all thermal gels for high-performance gap filling applications.
The Chomerics Therm-A-Gap Gel 75 is a high performance, one component, dispensable thermal interface material. It has 7.5 W/m-K thermal conductivity developed to conduct heat from electronics to a heat sink or enclosure.
Need a lower thermal conductivity? Therm-A-Gap Gel 37 can help.
This gel comes in a thicker consistency to help with control dispensing. The heavy paste-like material uses a low compression force, resulting in minimal stress to components and solder joints. Secondary curing is no longer required, as the thickness can be changed based on the application.
It is easily dispensed, making it excellent for automated dispensing machines, rework, and field repair situations. Compared to pad form thermal interface materials, Therm-A-Gap Gel 75 has a true one size fits all applicability.
It has the ability to conform to any surface leaving manufacturers with no open time or working issues. It also removes concerns about on the shelf material separation.
*Note: This Therm-A-Gap video features TC50, but it is applied in a similar fashion to Gel75, which has a 7.5 W/m-K thermal conductivity.
Typical applications include:
- Thermal heat dissipation for telecom base stations
- Power supplies and semiconductors
- Memory and power modules
Features and benefits:
- Thermal conductivity: 7.5 W/m-K
- Easily dispensed
- No secondary curing required
- Low thermal impedance
- Ultra-low compression force